- Wafers
- Substrates
- Microelectronic Packages
- Other applications
- Silicon (Si)
- Gallium arsenide (GaAs)
- Silicon carbide (SiC)
- Sapphire
- Gallium Nitride (GaN)
- Germanium (Ge)
- Ferrite
- Quartz and Fused Silica
- Other Compound Semiconductors
- LT (Lithium Tantalate) and LN (Lithium Niobate):
- Advanced Ceramics
- Diamond
- Glass Substrates
- Tungsten Carbide
- Piezoelectric Materials
- High Material Removal Rates (MRR)
- High Precision and Accuracy
- High Degree of Flatness
- Longer Life
- Minimal Subsurface Damage
- Minimal Heat Generation
- Reduce Material Contamination and Deformation
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Semiconductor wafers are routinely thinned prior to dicing to aid the sawing operation and to allow the final assembled package thickness to be minimized. For semiconductor devices required to operate at high power levels, wafer thinning improves the ability to dissipate heat by lowering the thermal resistance of die. As final thickness is decreased, the wafer progressively becomes less able to support its own weight and to resist the stresses generated by post backgrinding processes. Thus, it is important to reduce the damage caused by backgrinding.
UKAM Industrial Superhard Tools has the technology and expertise to help you optimize your backgrinding process to ultimate level of efficiency.
The available grit sizes typically range from coarse (around 60 grit) to ultra-fine (above 3000 grit), depending on the specific requirements of the grinding process.
The grit size choice depends on the desired surface finish and material removal rate. Coarser grits remove material faster but leave a rougher finish, while finer grits give a smoother finish but work more slowly.
Lifespan varies based on usage, the material being ground, and the wheel’s specifications. However, due to the hardness of diamond, these wheels generally have a longer lifespan compared to conventional abrasive wheels.
Store in a cool, dry place away from direct sunlight. Avoid storing under conditions of high humidity or drastic temperature changes.
Yes, diamond grinding wheels can be used for other materials like sapphire, gallium arsenide, and other compound semiconductors. However, the grinding parameters might need adjustments.
Ensure proper wheel dressing, maintain consistent grinding pressure, and use appropriate coolants to prevent thermal damage.
Common bond materials include resin, metal, vitrified, and electroplated. The choice of bond affects the wheel’s wear rate, heat dissipation, and grinding performance.
Resin bonds offer good flexibility and are suitable for fine grinding. Metal bonds are durable and used for rough grinding. Vitrified bonds have good form retention, and electroplated bonds offer precision.
RPM recommendations vary based on the wheel’s diameter, material being processed, and the desired finish. Always refer to the manufacturer’s guidelines.
Yes, especially wheels with vitrified and metal bonds. Redressing restores the wheel’s surface, typically using a dressing tool or stick.
Higher diamond concentrations offer longer wheel life but might result in higher grinding temperatures. Lower concentrations provide faster material removal but may wear out the wheel faster.
Always wear safety glasses, use guards on grinding machinery, and ensure proper ventilation. Also, avoid forcing the wheel onto the material; let the abrasive do the work.
Water-based coolants are commonly used. They dissipate heat effectively and prevent dust buildup.
Regular wheel dressing, consistent grinding parameters, and using a wheel with appropriate specifications for the job can help achieve this.
Yes, many diamond back grinding wheels are designed to integrate seamlessly with automated grinding systems.
While diamond grinding wheels might have a higher initial cost, their longer lifespan and efficiency can make them more cost-effective in the long run.
Yes, many manufacturers offer custom solutions tailored to specific applications or requirements.
While CMP offers exceptional surface finishes, diamond grinding is generally faster and can be more cost-effective for bulk material removal.
Used grinding wheels, especially those with specific bond materials, may have disposal guidelines. It’s best to consult with the manufacturer or local regulations.
Lead times vary by manufacturer and order volume. It’s best to check directly with suppliers.
Remember that specific answers can vary based on the grinding wheel’s manufacturer, so always refer to the manufacturer’s documentation or customer support for precise information.